Compact PCI

  • CPC-1817
  • CPC-1817
  • CPC-1817

6U Compact PCI Boards QM57 chipsetCPC-1817

    • Supports air-cooled or rugged conduction-cooled
    • Onboard 32nm intel® Core™ i7 mobile processor
    • Up to 8GB soldered DDR3 1066 ECC memory
    • 1*33MHz/32bit PMC site, 1*PCI-E x8 XMC site
    • Supports up to 5*GbE LAN, two for PICMG 2.16 packet switching
    • Supports onboard SATA drive, CF card and soldered 8GB NAND Flash
    • Supports 2*isolated RS232/422/485 port, up to 2.5kV
    • Available rear I/O board: CPC-RP807
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  • Specifications
  • Information
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Compact PCI BUS J1/J2 support 32Bit、33/66MHz CPCI BUS
Compatible PICMG 2.0 specification
PICMG 2.1 hot swap specification
3.3V/5V VIO signal environment
Expand CPCI BUS by PCI-E x16 to PCI bridge
CPU CPC-1817CLD5NA-H: i7-610E 2.53GHz, BGA, 4MB Smart Cache, 35W TDP
CPC-1817CLD5NA: i7-620LE 2.0GHz, BGA, 4MB Smart Cache, 25W TDP
CPC-1817-MIL: i7-620UE 1.06GHz, BGA, 4MB Smart Cache, 18W TDP
Mobile Intel® QM57 Express Chipset
Memory Onboard 4G DDR III ECC SDRAM 800/1066MHz memory
Display Support DVI-I+DVI-D dual-display, VGA, LVDS
Front : VGA:2048x1536@60Hz
Rear: DVI-D, DVI-I support dual-display up-down and left-right extended display mode, single display support1600x1200(60Hz)
Rear LVDS (18bit) share PINs with DVI-D
Storage Front I/O:Onboard 8GB SSD  CPC-1817CLD5NA: 1*2.5” SATA HDD; CPC-1817CLD5NA-MIL: 1*CF slot
Rear I/O: 2*SATA
PMC/XMC 1*32bit, 33MHz 3.3V/5V PMC site
1*XMC SITE via PCI-E x8 bus
LAN Rear I/O: 2*GbE
2*redundant GbE provide PICMG2.16 function to rear board
Front I/O CF slot
Rear I/O CPC-RP807:USB2.0x2、DB9 type RS232/422/485switchable, Y type PS/2, DVI-D, DVI-I, 2*GbE, MIC-IN/LAN-IN/LINE-OUT 
System detection WINBOND W83627DHG build-in watchdog timer, support 1-255 sec/min timer system reset or interrupt
Monitors system voltage, current and temperature
Mechanical specification Dimension:6U 4HP CompactPCI 233mm(L)x160mm(W)
Shock:·30g,11ms (operating)·50g,11ms (non-operating)
Vibration (5Hz-500MHz):·1.5g(operating)·2.0g(non-operating)
Salt-Fog test: 2g/m³according to GJB150.11A-2009
Mould test: Satisfy Class One according to GJB150.10A-2009
Wet-Hot test: No corrosion for metal component under 100% humidity; 40℃±2℃, Humidity 90%±3, normal storage and work
Oil-Fog test: 40mg/m³, normal storage and work
Compatible specification PICMG 2.0 R 3.0 CompactPCI Specification
PICMG 2.1 R 2.0 CompactPCI Hot Swap Specification
PICMG 2.16 R 1.0 Packet Switching Backplane Specification
OS Windows XP、Linux、Vxworks
Part Number Model Number Description



6U CompactPCI motherboard/i7-610E 2053GHz CPU,BGA/QM57 Express Chipset/VGA/Dual DVI (Rear)/Onboard 4GB DDR III ECC Memory/GbE/COM/2*USB/SATA HDD bay/Onboard 8GB SSD/PMC/XMC/-10~55℃


CPC-1817CLD5NA-MIL/ Tri-proof

6U CompactPCI Rugged conductive motherboard/i7-620UE 1.06GHz BGA CPU/QM57 Express Chipset/CF slot/Dual DVI (Rear)/Onboard 4GB DDR III Memory/Onboard 8GB SSD/-40~80℃ wide temperature


CPC-RP807/ Tri-proof

CPC-1817CL5NDA Rear IO board/DVI-I/DVI-D/ Onboard LVDS optional/COM/2*USB/2*GbE/Line-out/line-in/Mic-in/Onboard COM port pin/2*SATA

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