| 104-1812CLD2N |
| PC/104 SBC with Intel® Low power Embedded Platform |
| 104-1812CLD2N is an industrial embedded PC104 single board with high security, wide temperature and high performance at low power consumption. It contains Intel® Atom™ N270 processor and Mobile Intel® 945GSE + ICH7M chipset. The maximum power consumption of the motherboard is below 12W (including CF card, 1G onboard memory). Fanless, stable and reliable, this product can be widely used in the fields of medical treatment, numerical control and traffic system, etc. |
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| TDP |
11.2watt |
| Dimensions |
115.62mm x 97mm |
| Processor & Chipset |
Intel® ATOM™ N270 1.6GHz + Intel® 945GSE + Intel® ICH7M |
| Memory |
Onboard 1GB Memory |
| Ethernet & I/O Interface |
Onboard 2 x 1000Mbps, 4 x USB2.0, 2 x RS232, 2 x RS232/422/485 |
| Operating Temperature |
-40℃~+85℃ |
| Relative Humidity |
40℃, 5%-95% |
| Linux |
Kernel 2.6.26 |
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| JNB-1404 |
| Full Rugged and EMC/EMI Compliant Laptop |
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| JNB-1404 possesses wide temperature range, waterproof and dustproof capabilities, salt fog resistance, anti-vibration and anti-drop performance, portability, ruggedness, powerful mobile computing capability, adaptability to harsh environments, high reliability and stability. |
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| Anti-shock & Anti-vibration |
MIL-STD-810F |
| Processor & Chipset |
Intel® Core™ 2 Duo + Intel® GME965 + ICH8-M
Intel® L7500/1.6GHz/800MHz |
| Memory |
Onboard 512MB + 1 x SODIMM, supporting 2GB + 512MB DDR2 667 |
| Ethernet & I/O Interface |
Supports 1 x 1000Mbps, 3 x USB2.0, 2 x RS232/485, 1 x PCMCIA Type Ⅱ |
| Operating Temperature |
-20℃~+55℃ |
| Relative Humidity |
40℃, 5%-95% |
| Protection Grade |
IP54 |
| EMC/EMI |
MIL-STD-461E |
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| COM-1812LDNA |
| Low Power COM-Express Modular Computer with Intel® Embedded Platform |
| COM-1812LDNA is a standard motherboard designed for embedded computer COM-Express. COM-1812LDA combines the capacity of Intel® Core™2 Duo and some key features which are essential to modern embedded applications. COM-1812LDNA’s Core™ 2 Duo plus DDR2 533/667MHZ SODIMM high-speed storage enables powerful processing capability of the embedded computer module, making it an ideal choice for some high-performance applications, such as media processing and computerized imaging, etc. |
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| TDP |
14.3watt |
| Dimensions |
125mm x 95mm |
| Processor & Chipset |
Intel® Core™ 2 Duo U7500 + Intel® GM965 + ICH8M-E |
| Memory |
1 x SODIMM, supporting DDR2 667 up to 2GB |
| Ethernet & I/O Interface |
Onboard 2 x 1000Mbps, 8 x USB2.0, 3 x SATA |
| Operating Temperature |
0℃~+60℃ |
| Relative Humidity |
40℃, 5%-95% |
| Linux |
Kernel 2.6.26 |
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| MEC-5003 |
| Compact FANLESS Embedded Box PC with Low Power Core™ 2 Duo platform |
| MEC-5003 is a fanless embedded box PC designed based on dual-core low-power Core Duo. Its chassis is shaped by Al-alloy material, and features excellent sealing, dustproof, heat dispersion and anti-vibration performance. Its motherboard contains Intel® Core™ Duo T2500 and DDR2 memory, supports VGA, DVI independent dual display. The box PC can be widely used in vehicle-mounted navigation, intelligent traffic and digital video monitoring systems, etc. |
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| Anti-Shock |
10g/11ms |
| Anti-Vibration |
5-19Hz/1.2mm; 19-200Hz/1.2g |
| Dimensions |
270mm x 200mm x 88mm (LxDxH) |
| Processor & Chipset |
Intel® Core™ Duo T2500 + Intel® 945GM + ICH7 |
| Memory |
Onboard 512MB DDR2 Memory, up to 1GB |
| Ethernet & I/O Interface |
Supports 2 x 1000Mbps, 6 x USB2.0, 4 x RS232, 2 x RS232/422/485 |
| Operating Temperature |
-10℃~+60℃ |
| Relative Humidity |
40℃, 5%-95% |
| Expansion |
1 x PCI, 1 x PCI-E x4 |
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